FX Circuit
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FR4
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Tel: 0086-755-29121560
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Home > Capability

Productive Capability

Monthly Capacity : 6000 Sq.m. for Multilayers
Layer Counts: 1-40 Layers
Products Type: HF(High Frequency) & RF(Radio Frequency)board, Impedance controlled board, HDI board, BGA & Fine Pitch board, Thicker Copper

Board Material:
Base Material: FR4( Sheng Yi, KB, ITEQ)
Aluminum Based: Bergquist(USA), CSEM(TW)
HF&RF Products: Rogers, Taconic, Arlon, Nelco
High TG Products: Shengyi (S1170),Isola,IT180
Solder Mask: Taiyo
Finished Surface: HASL, Lead free HASL,
Immersion Gold, Immersion Silver, Immersion Tin,
Hard Gold, OSP,
Peelable Soldermask , Carbon Ink

Technical Specification
IPC: Class 3
Aspect ratio: 10:1
Max production size: 600X800mm
Minimum line width/gap: 3.0/3.0mil
Minimum hole size: 0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 10OZ
Board Thickness: Double Sides 0.2-7.0mm, Multilayers:0.40-7.0mm
Min Solder Mask Bridge: ≥0.08mm
Plugging Vias Capability: 0.2-0.8mm
Special Technique: Blind/Buried Via hole
Semi-plating holes
Countersink Hole
Via in Pad
Blind slot
Press fit technology
Edge-plating

Tolerance
Plated holes Tolerance: ±0.08mm(min±0.05)
Non-plated hole tolerance: ±0.05mm(min+0/-0.05mm or+0.05/-0mm)
Outline Tolerance: ±0.15mm(min±0.10mm)

Functional test
Insulating resistance: 50 ohms( normality)
Peel off strength: 1.4N/mm
Thermal Stress test: 260 degree,20 seconds
Solder mask hardness: 10V-250V
Warp and Twist: ≤0.7%

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