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Monthly Capacity : |
6000 Sq.m. for Multilayers |
Layer Counts: |
1-40 Layers |
Products Type: |
HF(High Frequency) & RF(Radio Frequency)board, Impedance controlled board, HDI board, BGA & Fine Pitch board, Thicker Copper |
Board Material: |
Base Material: |
FR4( Sheng Yi, KB, ITEQ) |
Aluminum Based: |
Bergquist(USA), CSEM(TW) |
HF&RF Products: |
Rogers, Taconic, Arlon, Nelco |
High TG Products: |
Shengyi (S1170),Isola,IT180
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Solder Mask: |
Taiyo |
Finished Surface: |
HASL, Lead free HASL,
Immersion Gold, Immersion Silver, Immersion Tin,
Hard Gold, OSP,
Peelable Soldermask , Carbon Ink |
Technical Specification |
IPC: |
Class 3 |
Aspect ratio: |
10:1 |
Max production size: |
600X800mm |
Minimum line width/gap: |
3.0/3.0mil |
Minimum hole size: |
0.15mm(mechanical drill)/4mil(laser drill) |
Minimum Annular Ring: |
4mil |
Max Copper thickness: |
10OZ |
Board Thickness: |
Double Sides 0.2-7.0mm, Multilayers:0.40-7.0mm |
Min Solder Mask Bridge: |
≥0.08mm |
Plugging Vias Capability: |
0.2-0.8mm |
Special Technique: |
Blind/Buried Via hole
Semi-plating holes
Countersink Hole
Via in Pad
Blind slot
Press fit technology
Edge-plating
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Tolerance |
Plated holes Tolerance: |
±0.08mm(min±0.05) |
Non-plated hole tolerance: |
±0.05mm(min+0/-0.05mm or+0.05/-0mm) |
Outline Tolerance: |
±0.15mm(min±0.10mm) |
Functional test |
Insulating resistance: |
50 ohms( normality) |
Peel off strength: |
1.4N/mm |
Thermal Stress test: |
260 degree,20 seconds |
Solder mask hardness: |
10V-250V |
Warp and Twist: |
≤0.7% |
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